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9 2009 . N 320-

 

 

 

 

Printed circuit boards. Terms and definitions

 

53386-2009

 

00

 

31.180

01.040.31

 

1 2011

 

 

27 2002 . N 184- " ", - 1.0-2004 " . ".

 

 

1. " - "" ( " "").

2. 420 " , ".

3. 9 2009 . N 320-.

4. .

 

" ", - " ". () " ". , - .

 

 

, .

.

- "".

, () , .

, , .

, , , , . , .

.

, , , - , - .

 

1.

 

.

, , , / .

 

2.

 

 

1. # #; (. & printed board;

&): , printed circuit

, board

, ,

,

,

,

.

 

2. # #: substrate

,

.

 

3. # #: , pattern

()

.

 

4. # #: conductive pattern

,

.

.

, , ,

,

.

 

5. # #: non-conductive

, pattern

.

 

6. # #; : , single-sided

printed board

.

 

7. # #; : , double-sided

printed board

.

 

8. # #; : , multilayer printed

board

,

.

 

9. # # (. &-&): two-level printed

, board

,

,

.

 

10. # #: , three-dimensional

molded

. interconnect

devices MID (3-D)

 

11. # #: , rigid printed

. board

 

12. # #: , flexible printed

. board

 

13. #- #: , flex-rigid printed

, board

.

 

14. # #; : flexible printed

, wiring

,

.

 

15. # #: metal core printed

, board

.

 

16. # # (. & mother board

; ;

&): ,

.

 

 

17. # #: conductor

.

 

18. # #: printed contact

,

.

 

19. # # (. & &): printed component

,

.

.

, .

 

20. # #: , embedded component

.

 

21. # #: conductor layer

,

.

 

22. # #: inner layer

,

.

 

23. # #: exteriority

, connection

.

 

24. # #: land

,

,

.

 

25. # #: edge board contact

,

.

 

26. # #: plated hole

.

 

27. # plated-through

#: , hole

()

.

 

28. # blind via

#: ,

.

 

29. # #: non-plated through

hole

.

 

30. # #: , component hole

,

.

 

31. # #: crossing hole

,

,

.

 

32. # #: buried via

,

.

 

33. # #: mounting hole

,

,

.

 

34. # #: component side

,

,

.

. - .

 

35. # #: interlayer

connection

.

 

36. # #: land pattern

, .

 

37. # guarantee bell

#:

.

 

38. # #: , grid

.

 

39. # #: pitch

.

 

40. # #: accuracy

,

.

.

, ,

.

 

41. # #: conductor width

.

 

42. # #: conductor size

.

 

43. # conductor spacing

#:

.

 

44. # layer-to-layer

#: spacing

.

 

45. # #: access hole

,

,

.

 

46. # #: printed shield

,

.

 

47. # #: bus

,

.

 

48. # #: , key

,

.

 

49. # #: keying slot

,

.

 

50. # #: , registration mark

.

 

51. # #: polarizing slot

,

.

 

52. # #: anchoring spur

,

.

 

53. # #: press-in

, connection

.

 

54. # #: jumper

,

.

 

55. # #: clinched-wire

, through

connection

,

.

 

56. # #: legend

.

. ,

..

 

57. #- #: test coupon

,

,

.

 

58. #-#: , test board

.

. -

.

 

59. # [, ] single-sided board

#: thickness [double-

[ sided, multilayer]

] . board thickness

 

60. # #: total board

, thickness

.

 

61. # #: conductor

. thickness

 

62. # #: group of

performance

,

.

. :

, , ,

, ,

.

 

63. # #: printed board

assembly

()

.

 

64. # #: , printed wiring

,

, .

 

 

65. # #: , critical defect

.

 

66. # hole pull strength

#: ,

,

.

 

67. # #: current-carrying

capacity

.

 

68. # dielectric

#: strength

.

 

69. # #: registration

,

.

 

70. # #: peel strength

, ,

,

.

 

71. # #: bond strength

,

,

,

.

 

72. # [] crazing

#:

[]

,

.

 

73. # #: metal migration

.

 

74. # #: soldering

.

 

75. # #: , bow

.

 

76. # #: twist

,

.

 

77. # #: undercut

.

 

78. # #: outgrowth

,

.

 

79. # #: , overhang

.

 

80. # #: blister

,

.

 

81. # #: dent

,

.

 

82. # #: inclusions

.

.

.

 

83. # #: bubble effect

,

.

 

84. # #: pit

,

.

 

85. # #: exfoliation

,

.

 

86. # #: , delamination

.

 

87. # #: , short circuit

,

.

 

 

88. # #: base material

, ()

.

 

89. # #: panel

,

.

 

90. # #: multiple printed

, panel

,

,

,

.

 

91. # #: technological

, margin of panel

,

,

,

,

, -

,

.

.

.

 

92. # #: tooling hole

,

.

 

93. # #: fully additive

process

.

 

94. # semi-additive

#: process

,

.

 

95. # #: direct

metallization

,

.

 

96. # subtractive

#: process

.

 

97. ##: tenting

.

 

98. #- #: tenting process

,

.

 

99. # solder mask over

#: base copper

, (SMOBC)

.

 

100. # #: screen printing

.

.

, .

 

101. # #: () etching

.

 

102. # #: immersion plaiting

.

 

103. # #: selective plaiting

.

. ,

, , -.

 

104. # infra-red reflour

#:

.

 

105. # #: tin-lead

- brightening

,

.

 

106. # #: photo resist

,

.

.

.

 

107. # #: negative-acting

, resist

,

.

 

108. # #: positive-acting

, resist

,

.

 

109. # #: plating resist

,

.

 

110. # #: , etch resist

.

.

-,

.

 

111. # #: master

,

.

.

,

, - .

 

112. # #: glass transition

temperature

.

 

113. # #: solder mask

,

.

 

114. # #: prepreg

, B-,

.

 

115. #B- B-stage

#:

,

, ,

, ,

.

 

116. # #: final finish

,

,

.

 

117. #- conductive anodic

#: filament (CAF)

,

,

.

 

 

# # 80

# # 82

# # 83

# # 81

# -# 117

#B- # 115

# # 52

# # 109

14

# # 62

# # 65

7

# # 89

# # 90

# # 87

# # 50

# # 75

# # 99

# # 14

# # 40

# # 48

# # 19

# # 20

# # 53

# # 18

# # 25

# # 56

# # 113

# # 88

# # 95

# # 73

# # 72

# # 72

# # 64

8

# # 79

# # 45

# # 104

6

# # 102

# # 103

# # 105

# # 2

# # 33

# # 26

# # 28

# # 27

# # 30

# # 29

# # 31

# # 92

# # 85

# # 49

# # 51

# # 74

# # 54

# # 55

# # 100

# # 1

# # 12

# -# 13

# # 7

# # 9

# # 11

& & 16

# # 8

& & 16

# # 16

# # 6

# # 10

& & 16

& & 1

# # 15

# # 24

# # 77

# # 116

# # 91

# # 37

1

# 66

#

# # 70

# # 71

# # 17

# # 93

# # 94

# # 96

# # 67

# # 78

# # 84

# # 86

# # 43

# # 44

# # 110

# # 36

# # 3

# # 5

# # 4

&-& 9

# # 38

# # 76

# # 23

# # 22

# # 21

# # 69

# # 35

# # 32

# # 34

# # 114

# # 112

## 97

#- # 98

#- # 57

#-# 58

# # 59

# # 59

# # 59

# # 61

# # 60

# # 101

# # 63

# # 68

# # 106

# # 107

# # 108

# # 111

# # 39

# # 42

# # 47

# # 41

# # 46

& & 19

 

 

access hole 45

accuracy 40

anchoring spur 52

base material 88

blind via 28

blister 80

bond strength 71

bow 75

B-stage 115

bubble effect 83

buried via 32

bus 47

CAF 117

clinched-wire through connection 55

component hole 30

component side 34

conductive anodic filament 117

conductive pattern 4

conductor 17

conductor layer 21

conductor size 42

conductor spacing 43

conductor thickness 61

conductor width 41

crazing 72

critical defect 65

crossing hole 31

current-carrying capacity 67

delamination 86

dent 81

dielectric strength 68

direct metallization 95

double-sided board thickness 59

double-sided printed board 7

edge board contact 25

embedded component 20

etching 101

etch resist 110

exfoliation 85

exteriority connection 23

final finish 116

flexible printed board 12

flexible printed wiring 14

flex-rigid printed board 13

fully additive process 93

glass transition temperature 112

grid 38

group of performance 62

guarantee bell 37

hole pull strength 66

immersion plaiting 102

inclusions 82

infra-red reflour 104

inner layer 22

interlayer connection 35

jumper 54

key 48

keying slot 49

land 24

land pattern 36

layer-to-layer spacing 44

legend 56

master 111

metal core printed board 15

metal migration 73

MID (3-D) 10

mother board 16

mounting hole 33

multilayer board thickness 59

multilayer printed board 8

multiple printed panel 90

negative-acting resist 107

non-conductive pattern 5

non-plated through hole 29

outgrowth 78

overhang 79

panel 89

pattern 3

peel strength 70

photo resist 106

pit 84

pitch 39

plated hole 26

plated-through hole 27

plating resist 109

polarizing slot 51

positive-acting resist 108

prepreg 114

press-in connection 53

printed board 1

printed board assembly 63

printed circuit board 1

printed component 19

printed contact 18

printed shield 46

printed wiring 64

registration 69

registration mark 50

rigid printed board 11

screen printing 100

selective plaiting 103

semi-additive process 94

short circuit 87

single-sided printed board 6

single-sided board thickness 59

SMOBC 99

soldering 74

solder mask 113

solder mask over base copper 99

subtractive process 96

substrate 2

technological margin of panel 91

tenting 97

tenting process 98

test board 58

test coupon 57

three-dimensional molded interconnect devices 10

tin-lead brightening 105

tooling hole 92

total board thickness 60

twist 76

two-level printed board 9

undercut 77

 

 







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